December 19, 2025

HanabiAI Co., Ltd.

HanabiAI Co., Ltd. (Headquarters: Tokyo, Japan; CEO: Kagaya Sano) attended SEMICON Japan 2025 held at Tokyo Big Sight. The primary purpose of our visit was to gain a structured understanding of the most advanced technology directions and engineering trends progressing across the semiconductor supply chain, and to incorporate those insights into our planning and requirements definition for Embodied AI SoC.

SEMICON Japan is a major industry event for semiconductor manufacturing and the broader microelectronics ecosystem, covering a wide range of domains including advanced process technologies, packaging and system integration, manufacturing, inspection and metrology, materials, and production equipment. Through concentrated exhibits and active discussions, the event provided high-density technical signals and enabled us to view how frontier technologies converge into manufacturable and deployable product forms from a supply chain and engineering perspective.

Key takeaways from the visit

During the event, HanabiAI focused on how engineering constraints at advanced nodes influence system-level design. We paid particular attention to design and manufacturing challenges driven by continued process scaling, the impact of packaging and system-level integration on power and thermal boundaries, and the role of reliability and quality frameworks in scalable supply and long-term operation.

Through on-site observation and extensive discussions, we gained a clearer engineering view across multiple frontier areas, and we will reflect these insights in our roadmap assessment and requirements breakdown for Embodied AI SoC.

Visit to the Rapidus booth and discussions

During SEMICON Japan 2025, HanabiAI visited the Rapidus booth and held discussions with Rapidus team members regarding our respective future plans, technology directions, and topics related to advanced process technologies. We also exchanged views on commercialization timelines and engineering considerations for practical deployment, further deepening our understanding of Rapidus’s approach and areas of focus.

In these discussions, we also reviewed Rapidus’s latest progress in 2nm. Rapidus has highlighted its advancement and plans for 2nm-class process technologies, including routes involving GAA. From HanabiAI’s perspective, progress at advanced nodes such as 2nm expands the opportunity space for higher compute density and energy efficiency, while simultaneously raising the bar for system-level co-design in real-world, long-running intelligent systems, including power and thermal design, reliability and lifetime, manufacturability, and supply stability.

Next steps

HanabiAI will consolidate what we learned at SEMICON Japan 2025 into system-level requirements and design boundaries for our Embodied AI SoC, and will proceed with phased validation and option comparisons to achieve a verifiable balance across performance, energy efficiency, and manufacturability.

Company Overview

Company Name:HanabiAI Co., Ltd.

Location:Tokyo, Japan

Business Areas:Centered on the development of robot AI brain technologies, we are building the development infrastructure and ecosystem for embodied AI robots

Website:https://www.hanabiai.jp